High-Bandwidth Memory Market

Global High-Bandwidth Memory Market Size (2024 to 2032)

The global high bandwidth memory market is predicted to reach USD 1.57 billion in 2024 and USD 9.60 billion by 2032, growing at a CAGR of 25.4% during the forecast period.

High-bandwidth memory is a standardized stacked memory technology that offers extremely broad data channels inside the stack and between memory and logic. Up to eight DRAM modules can be connected by two channels per module in an HBM stack. Up to four chips can be used in current implementations, which essentially equals 40 DDR cores in a tenth of the size. The bandwidth between DRAM chips, the module and logic (interposer technology), and the tiny form factor compared to DRAM DIMMs make this technology appealing.

Current Scenario of the Global High-Bandwidth Memory Market

There is an increasing demand for HPC systems since they must analyze large amounts of data. The HPC market is expanding due to rising interest in big data and the rapid expansion of data centers. Furthermore, governments will likely make significant investments in the industry due to the rising demand for cost-effective and flexible solutions. A lack of stability in harsh environmental conditions restrains the market. Extreme environmental conditions have a substantial impact on memory device durability and reliability. For example, the more thermal stress a memory device is exposed to, the greater the danger of being damaged, making it difficult for a market to grow.

REPORT COVERAGE

SEGMENTAL ANALYSIS

Global High-Bandwidth Memory Market Analysis By Application

The graphics segment will have the highest growth rate and market share—this market, which graphic card manufacturers back, will continue to rise gradually during the projection period.

Global High-Bandwidth Memory Market Analysis By System

On a single SoC, APUs combine GPU and CPU capabilities. It increases the overall energy efficiency of APUs by reducing connections between processors and processing speed due to a faster data transfer rate. As a result of the growing applicability in many industries, this drives market growth.

REGIONAL ANALYSIS

The rapid adoption of HBM memories in North America is due to the rise of high-performance computing (HPC) applications requiring high-bandwidth memory solutions for fast data processing. The expanding market for AI, machine learning, and cloud computing is driving up demand for HPC in North America. By consolidating multiple data centers across the country, the US government has launched the Data Center Optimization Initiative (DCOI) to provide better services to the public while increasing taxpayer return on investment. The consolidation process comprises the creation of hyper-scale data centers and the decommissioning of underperforming ones. The government has shut down over 3,215 data centers across the country so far.

KEY PARTICIPANTS IN THE GLOBAL HIGH-BANDWIDTH MEMORY MARKET

The major companies operating in the global high bandwidth market include AMD (US), Micron (US), Intel (US), Xilinx (US), Open-Silicon (US), Qualcomm (US), SK Hynix (South Korea), Fujitsu (Japan), Toshiba (US), and STMicroelectronics (Switzerland).

RECENT HAPPENINGS IN THE GLOBAL HIGH-BANDWIDTH MEMORY MARKET

• Micron Technology has announced the expansion of its commercial agreement with United Microelectronics (UMC), which will allow Micron to assure future supply for automotive, mobile, and critical clients. The two parties have agreed to drop all their complaints against each other. UMC would pay Micron a one-time payment of an undisclosed sum as part of the agreement.

• The Exynos Auto T5123 for 5G connection, the Exynos Auto V7 for complete in-vehicle infotainment systems, and the ASIL-B certified S2VPS01 power management IC (PMIC) for the Auto V series were all unveiled by Samsung Electronics.

• SK Hynix has established a new business unit dedicated only to the US market, where the memory chip giant has redoubled its efforts to establish a foothold and strengthen partnerships with local tech firms. Under the so-called "Inside America" strategy, the new US business unit intends to improve the firm's competitiveness in the NAND memory industry in the crucial US market amid a global chip scarcity and gain additional US tech giants as new clients. Under the unit, a distinct research team will be formed.

• NVIDIA unveiled NVIDIA Omniverse Avatar, a technology platform that allows users to create interactive AI avatars. Speech AI, computer vision, natural language comprehension, recommendation engines, and simulation technologies are all connected via Omniverse Avatar. The platform's avatars are interactive characters with ray-traced 3D images that can see, speak, converse on various topics, and interpret natively stated intent.

DETAILED SEGMENTATION OF THE GLOBAL HIGH-BANDWIDTH MEMORY MARKET INCLUDED IN THIS REPORT

This research report on the global high bandwidth memory market has been segmented and sub-segmented based on the application, system, and region.

By Application

• Graphics

• HPC

By System

• APU

• GPU

• CPU

By Region

• North America

  • The United States

  • Canada

  • Rest of North America

• Europe

  • The United Kingdom

  • Spain

  • Germany

  • Italy

  • France

  • Rest of Europe

• The Asia Pacific

  • India

  • Japan

  • China

  • Australia

  • Singapore

  • Malaysia

  • South Korea

  • New Zealand

  • Southeast Asia

• Latin America

  • Brazil

  • Argentina

  • Mexico

  • Rest of LATAM

• The Middle East and Africa

  • Saudi Arabia

  • UAE

  • Lebanon

  • Jordan

  • Cyprus