The Global Hermetic Packaging Market was worth USD 3.11 billion in 2023 and is anticipated to reach a valuation of USD 4.26 billion by 2029 from USD 3.28 billion in 2024. It is predicted to register a CAGR of 5.4% during the forecast period 2024-2029.
One of the advanced levels of the packaging technique is hermetic packaging. This helps in the protection of the sensitive electronic components and sensor components in the various devices used in the different sectors such as aerospace, defense, food & beverages, etc., from the external environment. The packaging benefits obtained from hermetic packaging by its usage are protection from high temperatures, electrical conductivity, shocks, and gases, and prevention of leakage of food from the storage containers. End-user verticals where the adoption of hermetic packaging is in healthcare, electronics, automotive, energy and nuclear safety, military and defense, aerospace, telecommunication, and many others, and major applications of hermetic packaging are seen in the sector of the electronic and semiconductors.
The benefits associated with hermetic packaging are media resistance, autoclavability, high electric insulation, stability towards thermal shock, lightweight, temperature stability, and others, which are prime factors for driving the hermetic packaging market in healthcare. This packaging mainly prevents contamination of delicate electronic components. These packages are also helpful in hearing devices to ensure the systematic functionality of the electronic components of the device within the human body.
Preserving the essential properties of the products that are becoming popular is possible through hermetic packaging. The advantages of using the hermetic package are an excellent barrier to gases & moisture and preventing food contamination in long-term storage without loss of taste and nutritional value, which are the driving factors for the hermetic packaging market. Flexibility, recyclability, and biodegradability are the features of this kind of foil sealing. These features can be achieved with the help of a special polymer material that can provide an oxygen-free environment inside the storage structure to preserve food for the long term by forming a tight seal.
The restraint always in the market is the present or the future existence of alternatives or substitutes to the hermetic packaging. The high cost during the forecast period hampered the growth of the hermetic packaging market. Working in harsh environments and critical applications in the military, medical, and aerospace sectors demands high standards for hermetic packaging. These toughest standards and regulations make the industries buy new test equipment, resulting in increased expenses for the industry that will become a restraint in the market growth, and the entry of new market players will be limited.
The usage of pressed ceramic packages is increasing in the aerospace industry, and this will act as a hermetic packaging market opportunity as pressed ceramic packages are one type of conformation of hermetic ceramic. The hermetically sealed terminals, headers, and connectors are extensively used in airplane systems. Protection of the delicate electronic components in the data recorders or flight black box hermetic connectors are used. The other advantage includes the prevention of fuel seepage from the fuel systems and tanks. The above features and use in the aerospace industry would create an immense market growth and development opportunity for hermetic packaging. During the forecast period, the increasing disposable expenditure, urbanization, upsurge in the automobile requirement, and affordability are great opportunities for the increase in sales in the hermetic packaging market.
REPORT METRIC |
DETAILS |
Market Size Available |
2023 to 2029 |
Base Year |
2023 |
Forecast Period |
2024 to 2029 |
CAGR |
5.4% |
Segments Covered |
By Type, End-user Industry, and Region. |
Various Analyses Covered |
Global, Regional, & Country Level Analysis; Segment-Level Analysis, DROC, PESTLE Analysis, Porter’s Five Forces Analysis, Competitive Landscape, Analyst Overview of Investment Opportunities |
Regions Covered |
North America, Europe, APAC, Latin America, Middle East & Africa |
Market Leaders Profiled |
Schott AG, SGA technologies, Ametek, Inc, NGK Spark Plug Co., Ltd, Teledyne Microelectronic Technologies, Kyocera Corporation, Legacy Technologies, Inc., Willow Technologies, Special Hermetic Products, Inc., Sinclair Manufacturing Company, and Others. |
Reed Glass is expected to have a significant share of the hermetic packaging market. This glass has numerous electronic applications as the demand for the protection, isolation, or being sealed of some discrete electronic components is increasing. It also has applications in the centralized locking system of automobiles. With the wide range of applications in different sectors, the demand for reed glass is anticipated to increase.
The share in terms of revenue for the aerospace and defense sector in the hermetic packaging market is around 30.2% in 2022. The trend of holding a high market share by aerospace and defense in the hermetic packaging market is expected to continue in the coming years. There is a growing security threat, a rapid increase in the defense budget, and changes in the political dynamics are contributing to the high investment requirement in the defense sector, which results in the driving demand for hermetic packaging. The increase in air freight and transportation combined with increase in the air passengers drives the demand for hermetic packaging.
The North American region is expected to hold a high share of the hermetic packaging market during the forecast period. The government's increased spending on the aerospace and defense sector is a prime market-boosting factor. For instance, the United States spent almost USD 773 billion on military expenditures. The hermetic packaging demand and the strengthening of the market are fuelled by the reliance on new aircraft.
In 2020, by using the SCHOTT Primoceler’s glass laser bonding technology the results of the NR600 Artificial Retina Device’s primary results are announced by the NanoRetina. The ultra-miniature and all-glass encapsulation of the device was done using the SCHOTT Primoceler’s hermetic glass wafer micro bonding.
In 2020, Schott AG company’s product portfolio is expanded with the launch of a wide range of hermetic products. A new revolutionary HEATAN technology is introduced by Schott AG.
Frequently Asked Questions
The expected market size of hermetic packaging is expected to be USD 4.26 billion by 2029.
The highly expensive hermetic packaging and alternative/substitute presence are a few market restraints.
The increase in the usage of hermetic packaging in the healthcare and food & beverage industries is the key market driver.
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