3D Printed Electronics Market

Global 3D Printed Electronics Market Size (2024 to 2029):

The size of the global 3D printed electronics market was worth USD 18.91 billion in 2023. The global market is anticipated to grow at a CAGR of 22.5% from 2024 to 2029 and be worth USD 63.90 billion by 2029 from USD 23.16 billion in 2024.

MARKET SCENARIO

3D printed electronics is a new technology that allows electronics to be integrated into or on top of gadgets. 3D printing was first used to add antennas and simple conductive interconnects to the outside of 3D injection-molded synthetic items. The invention of materials and processes to produce items' internal sophisticated circuitry can be created from a range of materials using new techniques, thanks to technological advancements in the 3D printed electronics sector. Customization can be a huge benefit in the additive manufacturing process in production to manufacture parts that are perfectly fitted to a circuit board or any other computerized equipment. The introduction of 3D printing has enabled the production of in-house circuit and circuit board prototypes, lowering costs, time, and concerns about intellectual property violations.

MARKET DRIVERS

From product design to rapid prototyping to materials, supplier sourcing, manufacturing, inventory, distribution, and aftermarket support, additive manufacturing or 3D printing has the potential to disrupt much of the electronics supply chain. In the electronics industry, 3D Rapid prototyping eliminates the need for tooling and molds during the manufacturing stage, allowing for faster, more cost-effective manufacturing of smaller batches and more product customization.

Raw materials can be exchanged with semi-fabricated goods, which can shorten and simplify the upstream supply chain. As inherent labor costs are removed from production inputs, procurement costs can be reduced.

MARKET RESTRAINTS

3D-printed electronics still face challenges, such as microelectronics accuracy and high-temperature processing. Despite its potential to support manufacturers' supply chain operations, 3D printing faces some intellectual property (IP) and technological challenges that could slow its adoption.

REPORT COVERAGE

SEGMENTAL ANALYSIS

Global 3D Printed Electronics Market Analysis By Type

• Antennas
• Printed Circuit Boards(PCBs) 
• Sensors
• Others

The market is segmented into Antennas, Printed Circuit Boards (PCBs), Sensors, and Others. The highest market share belongs to antennas. The environmental and technical benefits, as well as the potential for cost savings, are driving demand for this product. Because the actual dimension of a 3D printed antenna is less than that of conventional designs, they are meant to take up less space. Researchers were able to create the antenna arrays in their new format thanks to 3D printing. The experts decided after a thorough investigation that the design of 3D-printed antennas could be useful in the future for building mobile devices with 5G and higher capabilities.

Global 3D Printed Electronics Market Analysis By Technology

• Aerosol Jet Printing,
• Inkjet Printing,
• Others

The market is segmented into Aerosol Jet Printing, Inkjet Printing, and Others. Aerosol jet printing dominated the global 3D-printed electronics market. Aerosol jet printing, which uses functional nanomaterial inks, has emerged as a viable approach for micro-scale digital 3D printing. Aerosol jet printing can be used to print electronic goods such as antennas, printed circuit boards (PCBs), sensors, and more. The technique is presently opening up new options in product creation by removing old limits such as substrate shape, material incompatibilities, processing expense, and so on, allowing for greater flexibility.

Global 3D Printed Electronics Market Analysis By End Users

• Aerospace & Defense
• Automotive
• Consumer Electronics
• Healthcare
• Telecom
• Others

The market is segmented into Aerospace and Defense, Automotive, Consumer Electronics, Healthcare, Telecom, and Others. The aerospace and defense industries were among the first to use 3D printing. The need for sophisticated manufacturing technologies that securely combine electronic circuitry with physical packaging is increasing as the demand for new aerospace and defense electronic gadgets that pack more functionality into less area grows. Because of its amazing capacity to print electronics directly onto 3D surfaces, 3D printing is an excellent alternative for lowering device weight and size.

REGIONAL ANALYSIS

• North America
• Europe
• Asia-Pacific
• Latin America
• Middle East and Africa

North America claims the largest market share in 2020, coupled with increased government funding in 3D printing, well-established research and development facilities, emerging market competitors in the area, and a strong economy to support technological spending. Europe has the second-largest market share.

In the projection period, the Asia Pacific region will increase at the fastest pace, gaining a 32 % market share. This is because of the growing use of 3D printed electronics in a variety of industries, as well as the presence of large companies designing and manufacturing 3D printed electronics hardware and software in APAC. Furthermore, the quickly increasing automotive and consumer electronics sectors in India and China are contributing to Asia Pacific's phenomenal market growth.

KEY MARKET PLAYERS

Molex (US), Harris Corp (US), Optomec (US), Novacentrix (US), ISORG (France), Ceradrop (France), Enfucell (Finland), Zortrax (Poland), Notion Systems (Germany), Neotech AMT (Germany), and Others.

RECENT HAPPENINGS IN THE MARKET

• Onboard the WISA Wood sat Cube Sat, which is expected to launch near the end of 2021, a 3D printed electrical circuit fabricated on Zortrax Endureal will be tested. Since late 2019, Zortrax has been working with the European Space Agency* to develop a composite 3D printing technology that allows for the fabrication of space-ready objects with integrated polymeric-based electrical circuits. In this groundbreaking mission, an ESA-designed functional demonstrator manufactured using this technology will be flight-tested in low earth orbit.
• Nano Dimension Ltd. has received ISO 9001:2015 certification. This achievement signifies that the Company has met the highest quality requirements in all of its manufacturing operations. Companies that are ISO 9001:2015 certified demonstrate the focus and effort required to achieve uncompromising productivity and quality products while maintaining a commitment to customer pleasure and trust.
• Keyssa Inc., a pioneer in high-speed contactless connectors, has sold its core technology and intellectual property (IP) to Molex. Molex's push to expand and broaden its micro-connector portfolio with highly flexible, cable-free connectors for near-field, device-to-device applications will be complemented by Keyssa's wireless chip-to-chip technology, which comes with over 350 filed patent applications.